With the service of 5g, the 5th generation mobile communication system, is expected to be provided in the future. In this trend, the multi-layer substrate materials, which play a central role in the servers and routers supporting the communication network backbone system, should be halogen-free PCB materials in addition to high-capacity and high-speed transmission. With the help of unique resin design technology and blending technology, the company has realized the commercialization of multi-layer substrate materials for communication infrastructure equipment. The multilayer substrate materials have low transmission loss, high heat resistance and high reliability while corresponding to halogen-free.
[features]
1. Low transmission loss is realized while corresponding to halogen-free, which contributes to the large capacity and high-speed transmission of data communication
Relative permittivity (DK) [3] = 3.4 (12GHz) * 1 the company’s previous products 23.4 (12GHz) * 1
Dielectric dissipation factor (DF) [4] = 0.003 (12GHz) * 1 our company’s previous products ?? 20.004 (12GHz) * 1
2. Make contribution to the stable operation of the equipment through the multilayer substrate materials with high heat resistance and high reliability
Heat resistance of reflow soldering: 10 cycles pass (260 32 layers) our company’s previous products 28 layers, 10 cycles
Insulation reliability: 1000 hours pass (85 , humidity 85%, 50V) is the same as the company’s previous products 2, thermal expansion coefficient (thickness direction): 39ppm our previous products 245ppm
Glass transition temperature (TG) [5]: 250 °C / DMA, thermal decomposition temperature (TD) 435
The company’s previous products 2 TG 210 °C / DMA, TD 410
3. Corresponding to halogen-free, improve the manufacturability and processability of high-rise multilayer substrate with more than 20 layers
*1: specification value of glass cloth with low dielectric constant
*2. Ultra low transmission loss multilayer substrate material Megtron 6 (model r-5775)
[purpose]
Communication infrastructure, high-end servers, routers, switches, wireless base stations, etc. for ICT applications
General properties
