The IPC (Association Connecting Electronics Industries) is a widely recognized organization that develops and publishes standards related to the design, assembly, and manufacturing of electronic products, including PCBAs (Printed Circuit Board Assemblies). Here are some of the important IPC standard documents related to PCBA electronic products:
IPC/EIA J-STD-001C
Requirements for Soldered Electrical & Electronic Assemblies
IPC-EA-100-K
Electronic Assembly Reference Set
IPC-HDBK-001
Handbook & Guide to Supplement J-STD-001 with Amendment 1
IPC-A-610
Acceptability of Electronic Assemblies
IPC-HDBK-610
Handbook and Guide to IPC-A-610 (Includes IPC-A610B to C Comparison
ESD-20-20
ANSI/ESD S20.20-1999 Association Standard of an ESD Program
IPC-DRM-40
Through-Hole Solder Joint Evaluation Desk Reference Manual
IPC-DRM-SMT-C
Surface Mount Solder Joint Evaluation Desk Reference Manual
IPC-QE-615
Electronic Assembly Evaluation Handbook
IPC/WHMA-A-620
Requirements and Acceptance for Cable and Wire Harness Assemblies
IPC/JEDEC J-STD-012
Implementation of Flip Chip and Chip Scale Technology
IEC/PAS 62084
Implementation of Flip Chip and Chip Scale Technology
J-STD-026
Semiconductor Design Standard for Flip Chip Applications
J-STD-028
Performance Standard for Construction of Flip Chip and Chip Scale Bumps
IPC-SM-784
Guidelines for Chip-on-Board Technology Implementation
SMC-WP-003
Chip Mounting Technology
IPC/EIA J-STD-013
Implementation of Ball Grid Array & Other High-Density Technology
IEC/PAS 62085
Implementation of Ball Grid Array & Other High-Density Technology
IPC-7095
Design and Assembly Process Implementation for BGAs
IPC-MC-790
Guidelines for Multichip Module Technology Utilization
SMC-TR-001
An Introduction to Tape Automated Bonding Fine Pitch Technology
IPC-SC-60A
Post Solder Solvent Cleaning Handbook
IPC-SA-61
Post Solder Semi-Aqueous Cleaning Handbook
IPC-AC-62A
Aqueous Post Solder Cleaning Handbook
IPC-CH-65A
Guidelines for Cleaning of Printed Boards & Assemblies
IPC-9201
Surface Insulation Resistance Handbook
IPC-TR-468
Factors Affecting Insulation Resistance Performance of Printed Boards
IPC-TR-580
Cleaning and Cleanliness Test Program Phase 1 Test Results
IPC-TR-582
Cleaning & Cleanliness Test Program for: Phase-Low Solids Fluxes & Pastes Processed in Ambient Air
IPC-TP-1043
Cleaning & Cleanliness Test Program Phase 3 Water Soluble Fluxes Part 1
IPC-TP-1044
Cleaning & Cleanliness Test Program Phase 3 Water Soluble Fluxes Part 2
IPC-TR-476A
How to Avoid Metallic Growth Problems in Electronic Hardware
IPC-DRM-18F
Component Identification Desk Reference Manual
IPC/JEDEC J-STD-020A
Moisture/Reflow Sensitivity Classification for Non-Hermetic Solid State Surface Mount Devices
IPC/JEDEC J-STD-033
Standard for Handling, Packing, Shipping and Use of Moisture/Reflow Sensitive Surface Mount Devices
IPC/JEDEC J-STD-035
Acoustic Microscopy for Non-Hermetic Encapsulated Electronic Components
IPC-DRM-53
Introduction to Electronics Assembly Desk Reference Manual
IPC-PD-335
Electronic Packaging Handbook
IPC-7525
Stencil Design Guidelines
IPC-MI-660
Incoming Inspection of Raw Materials Manual
J-STD-004
Requirements for Soldering Fluxes
J-STD-005
Requirements for Soldering Paste
IPC-HDBK-005
Guide to Solder Paste Assessment
IPC/EIA J-STD-006A
Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solder
IPC-SM-817
General Requirements for Dielectric Surface Mounting Adhesives
IPC-CA-821
General Requirements for Thermally Conductive Adhesives
IPC-3406
Guidelines for Electrically Conductive Surface Mount Adhesives
IPC-3408
General Requirements for Aniso tropically Conductive Adhesives Films
IPC-CC-830A-AM
Qualification & Performance of Electrical Insulating Compound for Printed Board Assemblies-With Amendment 1
IPC-CC-830B
Qualification and Performance of Electrical Insulating Compound for Printed Wiring Assemblies
IPC-HDBK-830
Guideline for Design, Selection and Application of Conformal Coatings
IPC-SM-840C
Qualification and Performance of Permanent Solder Mask – Includes Amend 1
IPC-AJ-820
Assembly & Joining Handbook
IPC-7912
Calculation of DPMO & Manufacturing Indices for Printed Board Assemblies
IPC-9261
In-Process DPMO and Estimated Yield for PWAs
IPC-7530
Guidelines for Temperature Profiling for Mass Soldering (Reflow & Wave) Processes
IPC-9701
Performance Test Methods and Qualification Requirements for Surface Mount Solder Attachments
IPC-TP-1115
Selection and Implementation Strategy for a Low-Residue No-Clean Process
IPC-TR-460A
Trouble-Shooting Checklist for Wave Soldering Printed Wiring Boards
IPC-TA-722
Technology Assessment of Soldering
IPC-TA-723
Technology Assessment Handbook on Surface Mounting
IPC-SM-780
Component Packaging and Interconnecting with Emphasis on Surface Mounting
IPC-SM-785
Guidelines for Accelerated Reliability Testing of Surface Mount Attachments
IPC-S-816
SMT Process Guideline & Checklist
IPC-TR-581
IPC Phase III Controlled Atmosphere Soldering Study
IPC-9501
PWB Assembly Process Simulation for Evaluation of Electronic Components
IPC-9502
PWB Assembly Soldering Process Guideline for Electronic Components
IPC-9503
Moisture Sensitivity Classification for Non-IC Components
IPC-9504
Assembly Process Simulation for Evaluation of Non-IC Components (Preconditioning Non-IC Components)
IPC-CM-770D
Component Mounting Guidelines for Printed Boards
IPC-TP-1114
The Layman’s Guide to Qualifying a Process to J-STD-001
IPC-TR-467
Supporting Data & Numerical Examples for J-STD-001 (Control of Fluxes)
IPC-TP-1090
The Layman’s Guide to Qualifying New Fluxes
IPC-7711
Rework of Electronic Assemblies
IPC-7721
Repair and Modification of Printed Boards and Electronic Assemblies
IPC-7711/21
7711 &7721 Package.
IPC/EIA J-STD-002A
Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires
J-STD-003
Solderability Tests for Printed Boards
IPC-TR-461
Trouble-Shooting Checklist for Wave Soldering Printed Wiring Boards
IPC-TR-462
Solderability Evaluation of Printed Boards with Protective Coatings Over Long-term Storage
IPC-TR-464
Accelerated Aging for Solderability Evaluations
SMC-WP-005
PWB Surface Finishes
IPC-TR-465-1
Round Robin Test on Steam Ager Temperature Control Stability
IPC-TR-465-2
The Effect of Steam Aging Time and Temperature on Solderability Test Results
IPC-TR-465-3
Evaluation of Steam Aging on Alternative Finishes, Phase IIA
IPC-TR-466
Technical Report: Wetting Balance Standard Weight Comparison Test
SMC-WP-001
Soldering Capability White Paper Report
IPC-9850
Surface Mount Equipment Performance Characterization
SMEMA 1.2
Mechanical Equipment Interface Standard
SMEMA 3.1
Fiducial Mark Standard
SMEMA 4
Reflow Terms and Definitions
SMEMA 5
Screen Printing Terms and Definitions
SMEMA 6
Electronics Cleaning Terms and Definitions
SMEMA 7
Fluid Dispensing Terms and Definitions
PCB Design
IPC/JPCA-2315
Design Guide for High Density Interconnects & Micro vias
IPC-D-279
Design Guidelines for Reliable Surface Mount Technology Printed Board Assemblies
IPC-D-310C
Guidelines for Photo tool Generation and Measurement Techniques
IPC-A-311
Process Controls for Photo tool Generation and Use
IPC-D-322
Guidelines for Selecting Printed Wiring Board Sizes Using Standard Panel Sizes
IPC-D-330
Design Guide Manual
IPC-D-390A
Automated Design Guidelines
IPC-D-422
Design Guide for Press Fit Rigid Printed Board Back Plane
IPC-2220
IPC 2220 Design Standard Series
IPC-2221-KIT
Generic Standard on Printed Board Design – Includes Amendment 1
IPC-2222
Sectional Standard on Rigid Organic Printed Boards
IPC-2223
Sectional Design Standard for Flexible Printed Boards
IPC-2224
Sectional Standard of Design of PWB for PC Card
IPC-2225
Sectional Design Standard for Organic Multichip Modules (MCM-L) and MCM-L Assemblies
IPC-2615
Printed Board Dimensions and Tolerances
IPC-D-859
Design Standard for Thick Film Multilayer Hybrid Circuits
IPC-SM-782A
Surface Mount Design & Land Pattern Standard, Inc. Am. 1& 2
IPC-EM-782
Surface Mount Design & Land Pattern Standard Spreadsheet
SMC-WP-004
Design for Success
IPC-1902
IPC/IEC Grid Systems for Printed Circuits
PWB-CRT-SG01(HARD COPY) PWB-CERTCD01 (ELECTRONIC FORMAT)
IPC PWB Designer Certification Study Guide & CD
PWBADV-SG02 (HARD COPY) PWBADV-CD (ELECTRONIC FORMAT)
IPC PWB Advanced Designer Certification Study Guide & CD
IPC-D-356A
Bare Board Electrical Test Information in Digital Form
IPC-2511B
Generic Requirements for Implementation of Product Manufacturing Description Data & Transfer Methodology (GenCAMò)
IEC/PAS 62119
Generic Requirements for Implementation of Product Manufacturing Description Data & Transfer Methodology
IPC-2512A
Sectional Requirements for Implementation of Administrative Methods for Manufacturing Data Description
IPC-2513A
Sectional Requirements for Implementation of Drawing Methods for Manufacturing Data Description
IPC-2514A
Sectional Requirements for Implementation of Printed Board Manufacturing Data Description
IPC-2515A
Sectional Requirements for Implementation of Bare-Board Product Testing Data Description
IPC-2516A
Sectional Requirements for Implementation of Assembled Board Product Manufacturing Data Description
IPC-2517A
Sectional Requirements for Implementation of Assembly In-Circuit Test Data Description
IPC-2518A
Sectional Requirements for Implementation of Parts List Product Manufacturing Data Description
IPC-D-326
Information Requirements for Manufacturing Electronic Assemblies
IPC-2541
Generic Requirements for Electronics Manufacturing Shop Floor Equipment Communication
IPC-2546
Sectional Requirements for Specific Printed Circuit Board Assembly Equipment
IPC-2547
Sectional Requirements for Shop Floor Electronic Inspection and Test Equipment Communication
IPC-2571
Generic Requirements for Electronics Manufacturing Supply Chain Communication – Product Data exchange (PDX)
IPC-2576
Sectional Requirements for Electronics Manufacturing Supply Chain Communication of As-Built Product Data – Product Data exchange (PDX)
IPC-2578
Sectional Requirements for Supply Chain Communication of Bill of Material and Product Design Configuration Data-Product Data exchange
IPC-6010
Series IPC-6010 Qualification and Performance Series
IPC-A-600F
Acceptability of Printed Boards
IPC-6011
Generic Performance Specification for Printed Boards
IEC/PAS 62214
Generic Performance Specification for Printed Boards
IPC-6012A-AM
Qualification and Performance Specification for Rigid Printed Boards-Includes Amendment 1
IEC/PAS 62250
Qualification and Performance Specification for Rigid Printed Boards-Includes Amendment 1
IPC-6015
Qualification & Performance Specification for Organic Multichip Module (MCM-L) Mounting and Interconnections
IPC-TF-870
Qualification and Performance of Polymer Thick Film Printed Boards
IPC-QE-605A
Printed Board Quality Evaluation Handbook
IPC-PWB-EVAL-CH
Printed Wiring Board Defect Evaluation Chart
IPC-DW-424
General Specification for Encapsulated Discrete Wire Interconnection Boards
IPC-DW-425A
Design and End Product Requirements for Discrete Wiring Boards
IPC-DW-426
Specification for Assembly of Discrete Wiring
IPC-HM-860
Specification for Multilayer Hybrid Circuits
IPC-TR-470
Thermal Characteristics of Multilayer Interconnection Boards
IPC-TR-481
Results of Multilayer Tests Program Round Robin
IPC-TR-551
Quality Assessment of Printed Boards Used for Mounting and Interconnecting Electronic Components
IPC-TR-578
Leading Edge Manufacturing Technology Report
IPC-TR-579
Round Robin Reliability Evaluation of Small Diameter Plated Through Holes in PWBs
IPC-ML-960
Qualification and Performance Specification for Mass Lamination Panels for Multilayer printed Boards
IPC-DR-570A
General Specification for 1/8-inch Diameter Shank Carbide Drills for Printed Boards
IPC-DR-572
Drilling Guidelines for Printed Boards
IPC-NC-349
Computer Numerical Control Formatting for Drillers and Routers
IPC-IT-95080
Improvements/Alternatives to Mechanical Drilling of PWB Vias
IPC-MB-380
Guidelines for Molded Interconnection Devices
IPC-TA-721
Technology Assessment Handbook on Multilayer Boards
IPC-SM-839
Pre & Post Solder Mask Application Cleaning Guidelines
IPC-T50F
Terms & Definitions for Interconnecting & Packaging Electronic Circuits
IPC-D-325A
Documentation Requirements for Printed Boards
IPC-PE-740A
Troubleshooting for Printed Board Manufacture and Assembly
IPC-TA-724
Technology Assessment Series on Clean Rooms
IPC-HDI-1
High Density Interconnect Micro via Technology Compendium
IPC/JPCA-4104
Specification for High Density Interconnect (HDI) and Micro via Materials
IPC-6016
Qualification & Performance Specification for High Density Interconnect (HDI) Layers or Boards
IPC/JPCA-6801
IPC/JPCA Terms & Definitions, Test Methods, and Design Examples for Build-Up/High Density Interconnection
IPC-DD-135
Qualification Testing for Deposited Organic Interlayer Dielectric Materials for Multichip Modules
IT-30101
High Density PWB Micro via Evaluation, Phase I, round 3
IT-96060
High Density PWB Micro via Evaluation, Phase I, round 1
IT-97071
High Density PWB Micro via Evaluation, Phase I, round 2
IT-98123
Micro via Manufacturing Technology Cost Analysis Report
IPC-D-317A
Design Guidelines for Electronic Packaging Utilizing High Speed Techniques
IPC-2141
Controlled Impedance Circuit Boards & High-Speed Logic Design
IPC-D-316
High Frequency Design Guide
IPC-4103
Specification for Base Materials for High Speed/High Frequency Applications
IPC-6018A
Microwave End Product Board Inspection and Test
IPC-FC-231C
Flexible Base Dielectrics for Use in Flexible Printed Wiring
IPC-FC-232C
Adhesive Coated Dielectric Films for Use as Cover Sheets for Flexible Printed Wiring and Flexible Bonded Films
IPC-FC-234
Composite Metallic Materials Specification for Printed Wiring Boards
IPC-FC-241C
Flexible Metal-Clad Dielectrics for Use in Fabrication of Flexible Printed Wiring
IPC-6013-K
Qualification & Performance Specification for Flexible Printed Boards (Includes Amendment 1)
IEC/PAS 62249
Qualification & Performance Specification for Flexible Printed Boards (Includes Amendment 1)
IPC/JPCA-6202
IPC/JPCA Performance Guide Manual for Single- and Double-Sided Flexible Printed Wiring Boards
IEC/PAS 62123
Performance Guide Manual for Single- and Double-Sided Flexible Printed Wiring Boards
IPC-FA-251
Guidelines for Assembly of Single- and Double-Sided Flex Circuits
IPC-4101A
Specifications for Base Materials for Rigid and Multilayer Printed Boards
IPC-TR-483
Dimensional Stability Testing of Thin Laminates-Report on Phase 1 &2International Round Robin Test
IPC-TA-720
Technology Assessment Handbook on Laminates
IPC-4562
Metal Foil for Printed Wiring Applications
IPC-CF-148A
Resin Coated Metal for Printed Boards
IPC-CF-152B
Composite Metallic Materials Specification for Printed Wiring Boards
IPC-TR-482
New Developments in Thin Copper Foils
IPC-TR-484
Results of IPC Copper Foil Ductility Round Robin Study
IPC-TR-485
Results of Copper Foil Rupture Strength Test Round Robin Study
IPC-4121
Guidelines for Selecting Core Construction for Multilayer Printed Wiring Board Applications
IPC-EG-140
Specification for Finished Fabric Woven form “E” Glass for Printed Boards
IPC-SG-141
Specification for Finished Fabric Woven from “S” Glass for Printed Boards
IPC-4130
Specification & Characterization Methods for Nonwoven “E” Glass Materials
IEC/PAS 62212
Specification & Characterization Methods for Nonwoven “E” Glass Materials E
IPC-QF-143
Specification for Finished Fabric Woven from Quartz (Pure Fused Silica) for Printed Boards
IPC-4110
Specification and Characterization Methods for Nonwoven Cellulose Based Paper for Printed Boards
IPC-A-142
Specification for Finished Fabric Woven from Aramid for Printed Boards
IPC-4411-K
Specification and Characterization Methods for Non-Woven Para-Aramid Reinforcement, with Amendment 1
IPC-4411-AM1
Specification and Characterization Methods for Non-Woven Para-Aramid Reinforcement, Amendment 1
IEC/PAS 62213
Specification and Characterization Methods for Non-Woven Para-Aramid Reinforcement, without Amendment 1
IPC-TR-486
Round Robin Study to Correlate IST & Micro sectioning Evaluations for Inner-Layer Separation
IPC-9252
Guidelines and Requirements for Electrical Testing of Unpopulated Printed Boards
IPC-9191
General Guidelines for Implementation of Statistical Process Control (SPC)
IPC-TR-549
Measles in Printed Wiring Boards
IPC-MS-810
Guidelines for High Volume Microsection
IPC-OI-645
Standard for Visual Optical Inspection Aids
IPC-QL-653A
Certification of Facilities that Inspect/Test Printed Boards, Components & Materials
IPC-2524
PWB Fabrication Data Quality Rating System
IT-97061
PWB Hole to Land Misregistration: Causes and Reliability
IT-98103
Reliability of Misregistered and Landless Inner layer Interconnects in Thick Panels
These IPC standards are regularly updated to reflect industry advancements and best practices. It’s essential to refer to the most recent versions of these documents to ensure that your PCBA processes and designs align with current industry standards and practices. Additionally, it’s common for organizations to specify the IPC standards to be followed in contracts and manufacturing agreements to ensure consistency and quality in electronic product manufacturing.
