1. IoT PCB design field
IoT products usually collect information from the real world, hide it in the digital world, and then transfer the data to the cloud. Some analysis may be done and the results sent back. Therefore, there are four main areas of IoT design:
(a) Simulation
(b) Digital
(c) MEMS
(d) RF
MEMS sensors collect data and input it to microcontroller through analog-to-digital conversion. The results are transmitted through WiFi, Bluetooth, 3G / 4G and other standards. Depending on the response as part of the device's function, reverse path digital to analog conversion may also be performed. These are the areas in which designers will work.
2. Form and suitability of IoT pcb
Wearable devices illustrate the shape challenges faced by many IOT pcb designs. A company developing smart watches wants the same size and weight as traditional "dumb" timepieces. IoT innovators usually solve this problem from two starting points:
(a) Identify potential features, and then developers explore whether they can fit into a suitable saleable shell.
(b) Developers see the opportunity to add functionality to an existing product and then explore whether it can be done with as little impact as possible on the original product. Either way, complex functions may need to adapt to narrow spaces.
3. IoT design components
The main effect on "shape and fit" is to correctly identify the components filling PCB. However, these parts are only needed for the operation. We may also need fingerprint readers, different types of MEMS sensors or different RF standards. They need to be locked as early as possible – and don't forget external interfaces (buttons, switches, charging ports, etc.).
